THIN FILM DEVICE

PROBLEM TO BE SOLVED: To provide a thin film device which can reduce a parasitic capacity as much as possible. SOLUTION: A coil 16 is formed between a lower magnetic film 12 and an upper magnetic film 17, where the coil 16 is insulated from both films 12, 17. The coil 16 is so constructed as to have...

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description PROBLEM TO BE SOLVED: To provide a thin film device which can reduce a parasitic capacity as much as possible. SOLUTION: A coil 16 is formed between a lower magnetic film 12 and an upper magnetic film 17, where the coil 16 is insulated from both films 12, 17. The coil 16 is so constructed as to have a section 16M of a minimum width at edges closest to the lower and upper magnetic films 12, 17. This reduces a parasitic capacity generated between the coil 16 and the lower magnetic film 12, and the same between the coil 16 and the upper magnetic film 17, and also reduces a parasitic capacity generated between each wound wire of the coil 16. COPYRIGHT: (C)2007,JPO&INPIT
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The coil 16 is so constructed as to have a section 16M of a minimum width at edges closest to the lower and upper magnetic films 12, 17. This reduces a parasitic capacity generated between the coil 16 and the lower magnetic film 12, and the same between the coil 16 and the upper magnetic film 17, and also reduces a parasitic capacity generated between each wound wire of the coil 16. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
SEMICONDUCTOR DEVICES
TRANSFORMERS
title THIN FILM DEVICE
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