THIN FILM DEVICE

THIN FILM DEVICE

PROBLEM TO BE SOLVED: To provide a thin film device which can reduce a parasitic capacity as much as possible. SOLUTION: A coil 16 is formed between a lower magnetic film 12 and an upper magnetic film 17, where the coil 16 is insulated from both films 12, 17. The coil 16 is so constructed as to have...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: FUJIWARA TOSHIYASU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
SEMICONDUCTOR DEVICES
TRANSFORMERS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a thin film device which can reduce a parasitic capacity as much as possible. SOLUTION: A coil 16 is formed between a lower magnetic film 12 and an upper magnetic film 17, where the coil 16 is insulated from both films 12, 17. The coil 16 is so constructed as to have a section 16M of a minimum width at edges closest to the lower and upper magnetic films 12, 17. This reduces a parasitic capacity generated between the coil 16 and the lower magnetic film 12, and the same between the coil 16 and the upper magnetic film 17, and also reduces a parasitic capacity generated between each wound wire of the coil 16. COPYRIGHT: (C)2007,JPO&INPIT