POLYESTER COMPOUND, POLYBENZOXAZOLE RESIN, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a polyester compound good in solubility as a benzoxazole resin precursor giving a highly heat-resistant polybenzoxazole resin, to provide such a polybenzoxazole resin of high heat resistance and low dielectric constant, to provide a varnish, to provide a resin film,...

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Hauptverfasser: OKI HIROMI, ENOKI HISAFUMI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a polyester compound good in solubility as a benzoxazole resin precursor giving a highly heat-resistant polybenzoxazole resin, to provide such a polybenzoxazole resin of high heat resistance and low dielectric constant, to provide a varnish, to provide a resin film, and to provide a semiconductor device using the resin film. SOLUTION: The polyester compound contains 1st recurring units obtained by reaction between a bisphenol compound of the general formula(1)(wherein, X is a group of cage structure such as diamond structure) and a dicarboxylic acid compound. The polybenzoxazole resin obtained by cyclization reaction of the polyester compound is provided. The varnish and the resin film each using the polybenzoxazole resin are provided, respectively. The semiconductor device using the resin film is also provided. COPYRIGHT: (C)2007,JPO&INPIT