BONDING METHOD, MANUFACTURING METHOD OF LIQUID JETTING HEAD, BONDED SUBSTRATE, LIQUID JETTING HEAD, AND LIQUID JETTING DEVICE

PROBLEM TO BE SOLVED: To provide a bonding method which can prevent an adhesive from flowing out into a groove section, to provide a manufacturing method of a liquid jetting head, and to provide a bonded substrate, a liquid jetting head, and a liquid jetting device. SOLUTION: This bonding method is used to bond a first substrate having the groove section 18 which is opened on at least one surface, and a second substrate which is bonded to the one surface of the first substrate with the adhesive. A release groove 17 comprising a plurality of recessed sections is provided in a region on the outside of the groove section 18 of at least either one of the first substrate and the second substrate. When the first substrate and the second substrate are bonded with the adhesive, at least the recessed sections 15a and 16a being adjacent to a pressure chamber 12 of the release grooves 17 are opened to the atmospheric air under a state in which the first substrate and the second substrate are brought into contact with each other through the adhesive, and also, the pressure chamber 12 is sealed. COPYRIGHT: (C)2007,JPO&INPIT