SURFACE ACOUSTIC WAVE DEVICE

PROBLEM TO BE SOLVED: To provide a small and low-profiled surface acoustic wave (SAW) device with excellent functionality without the need for a complicated design, the characteristic of which is improved by reducing interference between elements. SOLUTION: In the SAW device including a base board,...

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Bibliographische Detailangaben
Hauptverfasser: KIHARA YOSHIICHI, OSANAI KATSUNORI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a small and low-profiled surface acoustic wave (SAW) device with excellent functionality without the need for a complicated design, the characteristic of which is improved by reducing interference between elements. SOLUTION: In the SAW device including a base board, an SAW element, and complementary circuit elements for complementing electric characteristics of the SAW element, the SAW element is flip-chip-mounted on one side of the base board and the complementary circuit elements are chip components surface-mounted on the base board. The chip components are provided with two or more inductive elements, and the inductive elements are mounted on the base board so that the magnetic fluxes of the inductive elements arranged adjacently to each other are interlinked with each other. The chip components may include one or more kinds of capacitors, varistors, and thermisters. The base board is a resin board made of a material principally containing a resin, a ceramic board, or a polymer material board, and a single layer board or a multilayer board including one or more wiring layers. COPYRIGHT: (C)2007,JPO&INPIT