RESIN APPLYING DEVICE

PROBLEM TO BE SOLVED: To provide a resin applying device capable of satisfactorily applying a resin between parts even for narrow gaps between parts at the time of a surface packaging. SOLUTION: A guide 20 is provided at an outer circumferential part of a tip of a needle 10. The guide 20 comprising a thin wire having a diameter of not more than 350 μm and a fixing end at an outer circumferential part of the needle 10. The guide 20 is once bent to a central direction of the needle 10 and extended to the position contacting the underfill resin ejected from a nozzle, and then bent again to an axis direction (a resin ejecting direction) and extended. The underfil resin 11 ejected from the nozzle of the tip of the needle 10 is guided by the guide 20 and filled in between parts even when the tip of the needle 10 would not enter between parts. COPYRIGHT: (C)2007,JPO&INPIT