SEMICONDUCTOR DEVICE MODULE AND ITS MANUFACTURING METHOD
PROBLEM TO BE SOLVED: To provide a semiconductor device module which is more reduced in external size (plane dimensions) and capable of restraining conductive lines from delaminating even when the device is subjected to an external shock. SOLUTION: An optical device module 1 serving as the semicondu...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a semiconductor device module which is more reduced in external size (plane dimensions) and capable of restraining conductive lines from delaminating even when the device is subjected to an external shock. SOLUTION: An optical device module 1 serving as the semiconductor device module is equipped with a board 10 where conductor wiring has been formed, an image sensing element 11 which serves as a semiconductor element formed on the board 10, bonding wires 13 which electrically connect the image sensing element 11 to the board 10 and are coated with covering materials 40, and a holder 20 which is arranged above the covering material 40 so as to serve as a lid. By this setup, a space for arranging the holders 20 on the board 10 is not required to be additionally secured, so that the semiconductor device module 1 can be more reduced in external size. That is, a useless space having no influence on the image sensing function of the device module 1 can be dispensed with. The bonding wires 13 are covered with the covering materials 40, so that the bonding wires 13 can be restrained from delaminating by an external force, and the device module 1 can be improved in shock resistance. COPYRIGHT: (C)2007,JPO&INPIT |
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