WAFER TRANSFER APPARATUS

PROBLEM TO BE SOLVED: To provide a wafer transfer apparatus for conducting transfer in accordance with transfer profiles even when such transfer profiles are different. SOLUTION: The wafer transfer apparatus 10 is constituted with a transfer apparatus 12 for extracting semiconductor wafers W from semiconductor wafer accommodating units 11A, 11B, and then transferring these wafers W and a mounting apparatus 15 for integrating the semiconductor wafers W and a ring frame RF. The mounting apparatus 15 includes a table 51 for supporting the semiconductor wafer W under the condition that any one of the front and rear surfaces thereof is selectively exposed, and thereby the semiconductor wafer W is transferred by attaching a mount tape to both semiconductor wafer W and ring frame RF. COPYRIGHT: (C)2007,JPO&INPIT