STACK STRUCTURE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a stack structure constituted of a substrate other than a silicon substrate, and its manufacturing method. SOLUTION: In the stack structure 1 obtained by stacking a first glass substrate 2 having a thin film heater 5, wherein an exothermic resistor film 6 is formed t...

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1. Verfasser: TERASAKI TSUTOMU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a stack structure constituted of a substrate other than a silicon substrate, and its manufacturing method. SOLUTION: In the stack structure 1 obtained by stacking a first glass substrate 2 having a thin film heater 5, wherein an exothermic resistor film 6 is formed through an adhesive film 8, provided on its one side 2a on a second glass substrate 4 to anodically join both substrates, a joining film 3 for anodically joining the second glass substrate 4 is formed on the part other than the adhesive film 8 of one side 2a of the first glass substrate 2, and the adhesive film 8 and the joining film 3 comprise the same component composition. COPYRIGHT: (C)2007,JPO&INPIT