ELECTRONIC COMPONENT ACCOMMODATION STRUCTURE

PROBLEM TO BE SOLVED: To provide electronic component accommodation structure having easier seal structure for quality control along with the workability upon the manufacture. SOLUTION: Electronic component accommodation structure 5 is constituted such that a first and a second housings that accommo...

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Bibliographische Detailangaben
Hauptverfasser: NIIMURA OSAMU, UECHI TATSUYUKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide electronic component accommodation structure having easier seal structure for quality control along with the workability upon the manufacture. SOLUTION: Electronic component accommodation structure 5 is constituted such that a first and a second housings that accommodate electronic components are combined in the mated face of the structure 5. In the mated face, there are formed a channel region 44 where a cooling fluid flows through the cooling channel and a communication passage region 46 where communication passage is arranged so as to communicate the accommodation chamber houses of the first and the second housing. Furthermore, in the mated face, an O ring 16 which is a sealing member integrally molded for sealing each of the regions 44 and 46 is arranged by surrounding the channel region 44 and the communication passage region 46 independently, respectively. Simply by arranging one sealing member in the mated face, it is made possible to seal the channel region 44 and the communication passage region 46 in the mated face independently, respectively. COPYRIGHT: (C)2006,JPO&NCIPI