ELECTROLESS NICKEL-COMPOSITE PLATING BATH AND ELECTROLESS NICKEL ALLOY-COMPOSITE PLATING BATH

PROBLEM TO BE SOLVED: To provide an electroless nickel (alloy)-composite plating bath which does not substantially contain lead of a hazardous material, makes an adequate film plated on a substrate, makes a water-insoluble material excellently co-deposit with the metal to enter into a plated film, a...

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Bibliographische Detailangaben
Hauptverfasser:	MOCHIZUKI YUKA, SUZUKI HIROYASU, NISHIKAWA KENICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electroless nickel (alloy)-composite plating bath which does not substantially contain lead of a hazardous material, makes an adequate film plated on a substrate, makes a water-insoluble material excellently co-deposit with the metal to enter into a plated film, and can be continuously used. SOLUTION: The electroless nickel-composite plating bath includes a water-soluble nickel salt, a reducing agent, molybdenum, antimony and a water-insoluble material. The electroless nickel alloy-composite plating bath includes a salt of an alloying metal in addition to them. COPYRIGHT: (C)2006,JPO&NCIPI