APPARATUS FOR PIERCING SUBSTRATE

PROBLEM TO BE SOLVED: To provide an apparatus for piercing a substrate, which apparatus can carry out the piercing of the workpiece substrate with high precision. SOLUTION: The apparatus for piercing the substrate comprises a laser beam source (24) for emitting a laser beam, a first stage (15) havin...

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Bibliographische Detailangaben
1. Verfasser:	FUKAZAWA TOSHIO
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an apparatus for piercing a substrate, which apparatus can carry out the piercing of the workpiece substrate with high precision. SOLUTION: The apparatus for piercing the substrate comprises a laser beam source (24) for emitting a laser beam, a first stage (15) having a first mirror (21) mounted on it, a second mirror (22), and a projection lens (23), and further comprises a second stage (19) mounted on the first stage (15), first driving means (13, 14) for driving the first stage (15) in the first direction, and second driving means (17, 18) for driving the second stage (19) in the second direction perpendicular to the first direction. COPYRIGHT: (C)2006,JPO&NCIPI