SUBSTRATE CLEANING APPARATUS

PROBLEM TO BE SOLVED: To provide a substrate cleaning apparatus cleaning both of the front and rear sides of a substrate by reducing the footprint of an apparatus, thereby improving throughput. SOLUTION: The peripheral part of a wafer W is held in the state in which a base member 2 and the wafer W a...

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Bibliographische Detailangaben
1. Verfasser:	OTANI MASAMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PERFORMING OPERATIONS PHYSICS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate cleaning apparatus cleaning both of the front and rear sides of a substrate by reducing the footprint of an apparatus, thereby improving throughput. SOLUTION: The peripheral part of a wafer W is held in the state in which a base member 2 and the wafer W are isolated with a holding member 6 installed on the base member 2. A first cleaning brush 21 for cleaning a first cleaning surface WF1 of a side facing the base member 2, out of the surface of the wafer W held with the holding member 6 is movably arranged and retained between the wafer W and the base member 2 by a first cleaning apparatus retaining arm 22, along a first cleaning surface WF1. While a wafer holding mechanism 1 and the wafer W held with the mechanism 1 are rotated by a rotating motor 11 via a hollow rotating shaft 9 linked with the base member 2, the first cleaning brush 21 is moved along the first cleaning surface WF1 by the moving power of a rotating motor 16. The first cleaning surface WF1 of the wafer W is cleaned with the first cleaning brush 21. COPYRIGHT: (C)2006,JPO&NCIPI