METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device using a collet which suppresses the entrainment of air to the minimum limit, and can stick a die bond film on a substrate. SOLUTION: The collet 1 has a pushing part 4 which pushes the die bond film 3, and a holder 5 fo...

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Bibliographische Detailangaben
1. Verfasser:	MISUMI KAZUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device using a collet which suppresses the entrainment of air to the minimum limit, and can stick a die bond film on a substrate. SOLUTION: The collet 1 has a pushing part 4 which pushes the die bond film 3, and a holder 5 for holding the pushing part 4. An elastic part 6 is formed between the pushing part 4 and the holder 5. The relation of W1