COOLING APPARATUS OF ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a cooling apparatus of electronic devices which can effectively cool by a single cooler a plurality of semiconductor chips, each of which generates large quantity of heat and occupies a small area. SOLUTION: The cooling apparatus has a plurality of electronic devices 2 mounted on a circuit substrate 1, each thermally conductive element 4 being formed on each electronic device 2 and having formed heat transfer fins 3, a housing 6 having formed fins 5 engaged with the fins 3 of the plurality of thermally conductive elements 4, and air-cooled fins 12 formed on the housing 6 and for carrying away the heat generated from the electronic devices 2. A flat-plate heat pipe 9 is formed in the inside of the housing 6. COPYRIGHT: (C)2006,JPO&NCIPI