ULTRASONIC JOINING HEAD AND DEVICE USING SAME

PROBLEM TO BE SOLVED: To provide an ultrasonic joining head for constituting a low price absorbing member which can be loaded to and unloaded from a horn and stably giving ultrasonic vibration to chip components with higher accuracy, and also to provide a device using the same head. SOLUTION: A rece...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IMAI KOICHI, UENISHI TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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