ULTRASONIC JOINING HEAD AND DEVICE USING SAME
PROBLEM TO BE SOLVED: To provide an ultrasonic joining head for constituting a low price absorbing member which can be loaded to and unloaded from a horn and stably giving ultrasonic vibration to chip components with higher accuracy, and also to provide a device using the same head. SOLUTION: A rece...
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Sprache: | eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide an ultrasonic joining head for constituting a low price absorbing member which can be loaded to and unloaded from a horn and stably giving ultrasonic vibration to chip components with higher accuracy, and also to provide a device using the same head. SOLUTION: A recessed region 26 is formed to the center of front end of the horn 17, and the absorbing member 19 having a projected region 32 as the absorbing region projected from the front end of the horn is accommodated at the center of the relevant recessed region. At the lower portion of the absorbing member 19, a side portion is provided as tapered to expand toward the bottom surface of the recessed region of horn 26, a sloping surface of the relevant side portion is in contact with a holding member 28, and the side portion of the absorbing member 19 is held and is tightened to the recessed region 26 of the horn 17 by tightening the relevant holding member 28 to the recessed region of horn 26. COPYRIGHT: (C)2006,JPO&NCIPI |
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