LIGHT EMITTING DIODE DEVICE EQUIPPED WITH FLIP CHIP STRUCTURE

PROBLEM TO BE SOLVED: To provide a light emitting diode device equipped with a flip chip structure. SOLUTION: The light emitting diode device comprises an insulating substrate, a light emitting diode flip chip structure, a sealing resin, and first and second electrical equipment. The feature of the...

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Bibliographische Detailangaben
Hauptverfasser:	CHANG CHUAN-MING, WANG CHIEN-JEN, CHANG NAI-WEN, CHIANG KUOUN, WANG WEI-JEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a light emitting diode device equipped with a flip chip structure. SOLUTION: The light emitting diode device comprises an insulating substrate, a light emitting diode flip chip structure, a sealing resin, and first and second electrical equipment. The feature of the diode flip chip structure is utilized to establish electrical connection between a p-type electrode and a p-type electrode layer as well as n-type electrode and an n-type electrode layer through the first and second electrical equipment. The light emitting diode omits a step of conventional wire bonding for improved production efficiency and a micronized product size. COPYRIGHT: (C)2006,JPO&NCIPI