PACKAGE FOR SEMICONDUCTOR AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a package for semiconductors capable of preventing warpage in a circuit board, and improving productivity. SOLUTION: The package 1 for semiconductors comprises a resin circuit board 3A having an opening 3a; a semiconductor mounting substrate 3B, and an electrode junction 3C for joining the substrates 3A, 3B; and a sealing frame 4 and an upper surface sealing plate 5 for airtightly sealing a semiconductor chip 2. The semiconductor mounting substrate 3B has a Young's modulus (at least 230×109(N/m2)) that is at least equivalent to that of the semiconductor chip 2, and a coefficient of thermal expansion (3×10-6-7.5×10-6(/°C)) close to that of the semiconductor chip 2. The semiconductor mounting substrate 3B cannot be deformed easily, and the thermal stress of the junction surface is small between the semiconductor chip 2 and the semiconductor mounting substrate 3B, thus suppressing the warpage in the resin circuit board 3A. When the package 1 for semiconductors is manufactured, the method of high productivity is applied using an assembled substrate 3 where a plurality of pieces of the resin circuit board 3A are formed integrally. COPYRIGHT: (C)2006,JPO&NCIPI