LITHOGRAPHY EQUIPMENT AND EQUIPMENT MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide lithography equipment, which can achieve more quick reaction time in such a way that buffer capacitance is offered so that gas pressure pulse buffered can be offered inside a supply line, and to provide an equipment manufacturing method. SOLUTION: The lithography equ...

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Bibliographische Detailangaben
Hauptverfasser:	HUBERTUS MUITJENS MARCEL JOHANNUS ELISABETH, SEVERIJNS RONALD WALTHER J, SONIA MARGART SKELLY, CADEE THEODORUS PETRUS MARIA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide lithography equipment, which can achieve more quick reaction time in such a way that buffer capacitance is offered so that gas pressure pulse buffered can be offered inside a supply line, and to provide an equipment manufacturing method. SOLUTION: The lithography equipment which comprises a lighting system offering a radiation projection beam, a gas pressure control object clamp which tightens an object arranged inside a passage of the radiation projection beam, the supply line arranged so that it can connect with the object clamp, and a pressure circuit controlling the object clamp. COPYRIGHT: (C)2006,JPO&NCIPI