MANUFACTURING METHOD OF LAMINATED ELECTRONIC COMPONENT AND APPARATUS THEREOF

PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated electronic component and the apparatus thereof wherein such a lamination is performed that the coincidence of the formations and set positions of its internal constituents is made highly accurate, and the accuracy of its predeter...

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Bibliographische Detailangaben
Hauptverfasser: TOSHIKURA KATSUHITO, YAMADA HIROFUMI, MAENAMI SHINYA, INOUE TORU, FUJIGAKI OSAMU, OTSUKI ATSUSHI, AOKI KIYOSHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated electronic component and the apparatus thereof wherein such a lamination is performed that the coincidence of the formations and set positions of its internal constituents is made highly accurate, and the accuracy of its predetermined functions is made improvable. SOLUTION: The manufacturing apparatus 1 comprises a sheet feeder for feeding a green sheet 8, a bonding-agent coater 3 for coating the green sheet 8 with a bonding agent, a rotating drum 4 for performing the winding lamination of the green sheet 8, an intaglio offset printer for performing the printing of internal constituents 16 on the green sheet 8, a recognizing mechanism 14 for recognizing the printed internal constituents 16, and a drying mechanism 13 for drying the printed internal constituents 16. Further, the manufacturing apparatus 1 recognizes by the recognizing mechanism 14 the positions of the internal constituents 16 printed on the green sheet 8, and so rotates an intaglio 5a and an offset roll 5b by a differential mechanism 15 as to perform the movement correction of the printing, and as to improve the printing accuracy of the intaglio offset printing portion. COPYRIGHT: (C)2006,JPO&NCIPI