SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To realize short wiring by lowering wiring impedance in a semiconductor device wherein a plurality of semiconductor devices are mounted on a packaging substrate. SOLUTION: The packaging substrate (2) has a plurality of semiconductor memory devices (4, 5) operated synchronously with a clock signal, and a semiconductor data processing device (3) for making access control for the semiconductor memory device. Arrangement of a data system terminal of a semiconductor memory device to a memory access terminal of a semiconductor data processing device is decided so that wiring of data and data strobe system (RTdq/dqs) is shorter than wiring of command address system (RTcmd/add). The wiring of data and data strobe system (RTdq/dqs) is laid by using a region between semiconductor memory devices. The wiring of the command address system (RTcmd/add) bypasses the side of the packaging substrate. COPYRIGHT: (C)2006,JPO&NCIPI