MARKING METHOD

MARKING METHOD

PROBLEM TO BE SOLVED: To provide a method for marking a sealing section efficiently and precisely. SOLUTION: The marking method includes a process for preparing an electronic module 1, containing a center region 12 and a lead frame 10 including an edge region 14 for surrounding the center region 12,...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KUDO JUN, OBA SHINICHIRO, ONO KENICHI, ABE YUSHIN, OKUYAMA KOHEI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for marking a sealing section efficiently and precisely. SOLUTION: The marking method includes a process for preparing an electronic module 1, containing a center region 12 and a lead frame 10 including an edge region 14 for surrounding the center region 12, and a plurality of sealing sections 20 formed in the center region 12; a process for supporting the edge region 14 by a conveyer 30 for conveying the electronic module 1, and for arranging the electronic module 1 at a marking position; a process for pressing the edge region 14 against the conveyer 30 by a press member 40 for flatting the electronic module 1; and a process for marking the sealing section 20 while the electronic module 1 has been flatted. COPYRIGHT: (C)2006,JPO&NCIPI