METHOD AND APPARATUS FOR MANUFACTURING MICROCHIP AND MICROCHIP

PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a microchip by which high joining strength and an excellent sealing property are attained and joining time is shortened, and the microchip manufactured at a low cost by the manufacturing method and having small deformation....

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Bibliographische Detailangaben
Hauptverfasser: TORIMURA MASAMOTO, UCHIDA KATSUHIDE, OSANAWA RYUICHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a microchip by which high joining strength and an excellent sealing property are attained and joining time is shortened, and the microchip manufactured at a low cost by the manufacturing method and having small deformation. SOLUTION: The microchip manufacturing method having a joining step for joining a fine channel-formed substrate to a glass substrate has a step for allowing a heating apparatus to face the substrate and the glass substrate by moving the heating apparatus using a light source as heat source radiation or the superimposed substrate and the glass substrate in the XY-axial direction and the joining step for irradiating a joining part between the substrate and the glass substrate with the heat source radiation from the heating apparatus to form a joining line on both sides of the fine channel. COPYRIGHT: (C)2006,JPO&NCIPI