APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus capable of suppressing the scattering of particles by a conveyance mechanism. SOLUTION: The semiconductor manufacturing apparatus comprises the conveyance mechanism in which a moving part moves along a conveying passage extending laterally; a plurality of processing units disposed along the conveying passage for delivering a substrate between the processing units and the conveying mechanism; an exhaust chamber provided at the lower part of the processing units, and having an exhausting opening part on the side of the conveying passage; a suction exhaust passage connected with the exhaust chamber; and a guide member provided at a position facing the inside of the exhaust chamber or facing the opening part, so as to extend along the conveying passage for guiding the moving part. There is produced a suction air flow directed from the conveying passage to the exhaust chamber by sucking and exhausting the inside of the exhaust chamber, so that, even when the moving part moves through the guide member to cause particles, the particles flow into the exhaust chamber and are removed from the conveying passage to reduce the scattering of the particles. COPYRIGHT: (C)2006,JPO&NCIPI