TIN-COATED COPPER POWDER AND COMPOSITE ELECTRICALLY CONDUCTIVE PASTE USING THE TIN-COATED COPPER POWDER

PROBLEM TO BE SOLVED: To provide tin-coated copper powder particularly as composite electrically conductive metal power for a substitute for lead-free solder composed of fine particles with the particle diameter of ≤5 μm, having excellent dispersibility and capable of low temperature sintering, and...

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIMARU KATSUHIKO, FURUMOTO KEITA, SAKAGAMI TAKAHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CASTING CHEMISTRY FERROUS OR NON-FERROUS ALLOYS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY PERFORMING OPERATIONS POWDER METALLURGY TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide tin-coated copper powder particularly as composite electrically conductive metal power for a substitute for lead-free solder composed of fine particles with the particle diameter of ≤5 μm, having excellent dispersibility and capable of low temperature sintering, and which can form an electrically conductive part. SOLUTION: The tin-coated copper powder is constituted so that the particles of copper powder are used as a core material, and the surface of each particle is provided with a tin-coated layer, wherein the particles of copper powder in which the value of the average particle diameter is 0.1 to 5 μm are used as the core material, and the surface of each particle of the copper powder is provided with a tin-coated layer of 40 to 70 wt.%. COPYRIGHT: (C)2006,JPO&NCIPI