RESIN SEALED SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To reduce warpage of a semiconductor device, even when a semiconductor element is made thin in a resin sealed semiconductor device, where the semiconductor element and a substrate are connected by wire bonding. SOLUTION: In the semiconductor device, a plurality of electrode pads are arranged in a train on the peripheral section of the semiconductor element. A plurality of bonding pads for connection with the electrode pads are disposed on the first surface of a substrate, and a plurality of external electrode terminals are disposed on the second surface of the same on a side opposite to the same. The electrode pads and the bonding pads are electrically connected through wires. A plate-shaped member is fixed by bonding to the inside of the electrode pad train on the semiconductor element. The semiconductor element, wire, and at least the peripheral side surface of the plate shaped member are integrally sealed with sealing resin. In the semiconductor device, the plate-shaped member has a thermal expansion coefficient smaller than that of the sealing resin. COPYRIGHT: (C)2006,JPO&NCIPI