WIRING SUBSTRATE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a wiring substrate wherein a bump is formed on the surface of a substrate body and a conductor pin or the like is fitted on the rear surface thereof by a brazing material whose melting point is approximate to that of the bump, and wherein the conductor pin can be prevented from falling even if the bump is heated, and to provide its manufacturing method. SOLUTION: The wiring substrate 1 is provided with a substrate body 2 which has a front surface 3 and a rear surface 4 and is made of an insulating material such as glass ceramic, a plurality of bumps 6 being conductive to IC chips (electronic components) C to be mounted on the front surface 3, and a plurality of conductor pins P which are formed on the rear surface 4 of the substrate body 2 by a brazing material 9. In addition, a resin layer 10, which is not softened at the melting point of the bump 6 and the brazing material 9, is formed in the vicinity of the brazing material 9 enclosing the nail head 12 of the conductor pin P. COPYRIGHT: (C)2006,JPO&NCIPI