EPOXY RESIN COMPOSITION AND EPOXY RESIN CURED PRODUCT

PROBLEM TO BE SOLVED: To provide an epoxy resin cured product having higher heat resistance than ever, and to provide an epoxy resin composition capable of realizing the same. SOLUTION: This epoxy resin composition is compounded of an epoxy resin which has two or more epoxy groups in a molecule ther...

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Hauptverfasser:	AKUTSU FUMIHIKO, KUWATA HIROAKI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin cured product having higher heat resistance than ever, and to provide an epoxy resin composition capable of realizing the same. SOLUTION: This epoxy resin composition is compounded of an epoxy resin which has two or more epoxy groups in a molecule thereof and a curing agent which contains an aromatic amine having an oxazole ring. COPYRIGHT: (C)2006,JPO&NCIPI