SEMICONDUCTOR PACKAGE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a semiconductor package used for digital optical equipment and a method of manufacturing the semiconductor package. SOLUTION: A semiconductor package 1 comprises at one side face consisting of a silicon material of fixed capacity: a wafer 20 on which pad electrodes 28 are formed; an IR filter stuck on the pad electrodes 28 of the wafer 20 with adhesives; terminals electrically linked with the pad electrodes 28 respectively in via-holes formed at opposite side views of the pad electrodes 28 of the wafer 20; and bump electrodes each connected with one side thereof every terminal, wherein a capacity of the semiconductor package 1 equipped with an image sensor 22 called as CMOS or CCD is miniaturized by applying a wafer level package technology, a production cost is reduced, and an effect advantageous to a mass production is obtained. COPYRIGHT: (C)2006,JPO&NCIPI