METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed circuit board which provides a fine circuit pattern and a via hole with no residue by forming the circuit pattern by an imprint method and forming the via hole with a laser. SOLUTION: After laminating an insulating layer in a semi-cured condition on a base substrate on which a first circuit pattern and a lower land are formed, a mold in which a pattern corresponding to a second circuit pattern is formed and the base substrate on which the insulating layer is laminated are matched. To form a groove for the second circuit pattern in the insulating layer, the insulating layer is etched using the mold, and fully cured. The via hole penetrating through the insulating layer to the lower land is formed by laser. A non-electrolytic plating layer is formed on the insulating layer, and the inside of the groove for the second circuit pattern and the via hole. Then an electrolytic plating layer is formed on the non-electrolytic plating layer. Then the non-electrolytic plating layer and the electrolytic plating layer are polished until the insulating layer is exposed. COPYRIGHT: (C)2006,JPO&NCIPI