METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING EQUIPMENT

PROBLEM TO BE SOLVED: To reduce a manufacturing cost in assembling a semiconductor device. SOLUTION: Semiconductor manufacturing equipment comprises a pump system 20 including a gear pump 12 which incorporates a gear structure consisting of a gear 13 for a pump and a gear 14 for driving which are co...

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1. Verfasser:	OKAYAMA MASAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MECHANICAL ENGINEERING POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC FLUIDS ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENTMACHINES FOR LIQUIDS ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENTPUMPS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To reduce a manufacturing cost in assembling a semiconductor device. SOLUTION: Semiconductor manufacturing equipment comprises a pump system 20 including a gear pump 12 which incorporates a gear structure consisting of a gear 13 for a pump and a gear 14 for driving which are coaxially and integrally formed, a main controlling unit 22 for controlling the pump system 20, and a stage 23 which can support a plate-like member such as a lead frame 24. By applying driving force to the gear 14 for driving to rotate the gear 13 for a pump in the gear pump 12, a paste material 3 is applied onto the plate-like member. By using the gear pump 12, a manufacturing cost and assembling cost of the gear can be reduced, resulting in leading to the reduction in manufacturing cost of the semiconductor device. COPYRIGHT: (C)2006,JPO&NCIPI