INTERPOSER MOUNTING METHOD AND INTERPOSER MOUNTED SHEET

PROBLEM TO BE SOLVED: To easily bond an antenna formed sheet and an interposer and a release sheet, and to reduce the amounts of adhesive necessary for formation of an adhesive layer. SOLUTION: An adhesive layer 30 is formed in almost the overall region of the surface of an antenna formed sheet 20 a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SAKATA HIDETO, SHIMOMURA KIICHI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To easily bond an antenna formed sheet and an interposer and a release sheet, and to reduce the amounts of adhesive necessary for formation of an adhesive layer. SOLUTION: An adhesive layer 30 is formed in almost the overall region of the surface of an antenna formed sheet 20 at an antenna 22 side. An interposer 10 is bonded on an adhesive layer 30 formed on the antenna formed sheet 20. An extended electrode 12 of the interposer 10 is electrically connected to the antenna 22 of the antenna formed sheet 20. A release sheet 40 is placed through the interposer 10 on the adhesive layer 30 on the antenna formed sheet 20 so that an interposer mounted sheet can be manufactured. COPYRIGHT: (C)2006,JPO&NCIPI