PACKAGE FOR GALLIUM NITRIDE SEMICONDUCTOR DEVICE

PACKAGE FOR GALLIUM NITRIDE SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a package improved for power semiconductor devices. SOLUTION: A packaged semiconductor device includes a support 104 for mounting a die 105, the bottom surface of the die is attached to the uppermost surface of the die-supporting support, plural external conductors 1...

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Bibliographische Detailangaben
Hauptverfasser: PERES BORIS, SHELTON BRYAN S, ZHU TINGGANG, PABISZ MAREK K, GOTTFRIED MARK, LIU LINLIN, CERUZZI ALEX D
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a package improved for power semiconductor devices. SOLUTION: A packaged semiconductor device includes a support 104 for mounting a die 105, the bottom surface of the die is attached to the uppermost surface of the die-supporting support, plural external conductors 101, 102, and 103 spaced at intervals extend from the support, at least one of the external conductors spaced at the intervals has a post 110 for bond wire at one end portion thereof, and a boding wire 108 extends between the post for bond wire and a contact region to the uppermost surface of two or more mesas. COPYRIGHT: (C)2006,JPO&NCIPI