WIRING BOARD

PROBLEM TO BE SOLVED: To provide a wiring board with excellent connection reliability as well as low electric resistance that prevents a metallized wiring layer comprising copper or an alloy predominantly composed of copper from being separated from an insulating substrate when the metallized wiring is connected to an external electric circuit via a low-melting brazing filler metal, and effectively prevents the warpage of the wiring board. SOLUTION: The wiring board 9 comprises the insulating substrate 1 made of a glass ceramic sintered compact, and the metallized wiring layer 2 that is formed on the surface of the insulating substrate 1 and includes copper or a metal predominantly composed of copper, wherein the metallized wiring layer 2 is electrically connected to the external electric circuit via the low-melting brazing filler metal, and the metallized wiring layer 2 has at least a part which is electrically connected to the external electric circuit and includes 0.5 to 10 mass parts of forsterite and 0.5 to 10 mass parts of silica with respect to 100 mass parts of a metal content. COPYRIGHT: (C)2006,JPO&NCIPI