BAKING APPARATUS OF SEMICONDUCTOR WAFER

PROBLEM TO BE SOLVED: To provide a baking apparatus of a semiconductor wafer. SOLUTION: The baking apparatus of a semiconductor wafer comprises a hot plate, a vessel whose upper part is opened for the hot plate to be installed, and a cover to cover the upper part of the vessel. The cover comprises a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE JIN-SUNG, LEE DONG-WOO, BOKU TAISO, LIM JONG-KILL, KIM TAE-GYU, JUNG CHANG-HOON, LEE BANG-WEON, WEE SANG-KWON
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FURNACES FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL HEATING KILNS LIGHTING MECHANICAL ENGINEERING OPEN SINTERING OR LIKE APPARATUS OVENS RETORTS SEMICONDUCTOR DEVICES WEAPONS
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