BAKING APPARATUS OF SEMICONDUCTOR WAFER

PROBLEM TO BE SOLVED: To provide a baking apparatus of a semiconductor wafer. SOLUTION: The baking apparatus of a semiconductor wafer comprises a hot plate, a vessel whose upper part is opened for the hot plate to be installed, and a cover to cover the upper part of the vessel. The cover comprises a...

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Bibliographische Detailangaben
Hauptverfasser:	LEE JIN-SUNG, LEE DONG-WOO, BOKU TAISO, LIM JONG-KILL, KIM TAE-GYU, JUNG CHANG-HOON, LEE BANG-WEON, WEE SANG-KWON
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FURNACES FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL HEATING KILNS LIGHTING MECHANICAL ENGINEERING OPEN SINTERING OR LIKE APPARATUS OVENS RETORTS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a baking apparatus of a semiconductor wafer. SOLUTION: The baking apparatus of a semiconductor wafer comprises a hot plate, a vessel whose upper part is opened for the hot plate to be installed, and a cover to cover the upper part of the vessel. The cover comprises an upper plate and a lower plate between which a gas flow space is provided to face to each other, and a side wall of a specified height provided to an edge between them. The side wall is provided with at least one gas inlet, and a plurality of gas supply holes are provided in the central region of the lower plate. The lower edge of the cover is connected to a skirt of specified height to which a gas exhausting part is provided. COPYRIGHT: (C)2006,JPO&NCIPI