POLISHING MACHINE

PROBLEM TO BE SOLVED: To provide a polishing machine which can be installed in a clean room that can efficiently prevent contamination. SOLUTION: The polishing machine is provided with a loading/unloading block 7 for the delivery of a cassette 13 housing a wafer 16, a carrier block 8 for moving the...

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Bibliographische Detailangaben
Hauptverfasser:	KODAMA SHOICHI, HIUGA KAZUAKI, IMOTO YUKIO, NISHI TOYOMI, WATASE MASAKO, SHIGETA ATSUSHI, YAJIMA HIROMI, TOGAWA TETSUJI, AOKI RIICHIRO, MISHIMA SHIRO, KONO YOSHISUKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CONVEYING DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING HANDLING THIN OR FILAMENTARY MATERIAL MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS POLISHING SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a polishing machine which can be installed in a clean room that can efficiently prevent contamination. SOLUTION: The polishing machine is provided with a loading/unloading block 7 for the delivery of a cassette 13 housing a wafer 16, a carrier block 8 for moving the wafer 16 from the cassette 13, a polishing block 6 for polishing the wafer 16, a cleaning block 9 for cleaning and drying the wafer 16 after polishing, and a control block 10 for controlling the operation of the machine by forming a ceiling and surrounding wall plates so as to surround the whole of the blocks to constitute a box. The wafer 16 is polished by the polishing block 6, and the polished wafer 16 is moved from the polishing block 6 to the cleaning block 9. Then the wafer 16 is cleaned and dried, and then taken out of the polishing machine. COPYRIGHT: (C)2006,JPO&NCIPI