CHUCK PLATE ASSEMBLY EQUIPPED WITH COOLING FUNCTION

CHUCK PLATE ASSEMBLY EQUIPPED WITH COOLING FUNCTION

PROBLEM TO BE SOLVED: To provide a shadow mask frame assembly equipped with heat dissipation and cooling functions for improving position accuracy of a pattern of an organic electroluminescence element by suppressing thermal expansion of a shadow mask. SOLUTION: The shadow mask frame assembly compri...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LEE SUNG-HO, KAN SHOSHIN, KYO MEISHU, KANG HEE CHEOL, TEI SHAKUKEN, SO KANSHO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a shadow mask frame assembly equipped with heat dissipation and cooling functions for improving position accuracy of a pattern of an organic electroluminescence element by suppressing thermal expansion of a shadow mask. SOLUTION: The shadow mask frame assembly comprises the shadow mask 20 on which the pattern is formed, and a mask frame 10 with a part thereof to which the shadow mask 20 adheres and which is exposed to an deposition source 70 on which a cooling plate is mounted. COPYRIGHT: (C)2006,JPO&NCIPI