COOLING DEVICE AND ELECTRONIC UNIT PROVIDED THEREWITH

PROBLEM TO BE SOLVED: To provide a small cooling device where an exothermic electronic component on a substrate can highly efficiently be cooled and the passage resistance of piping is small, and to provide an electronic unit provided with the cooling device. SOLUTION: In the cooling device, a liqui...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KUSAKABE TAKESHI, AIZONO MASAMITSU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!