COOLING DEVICE AND ELECTRONIC UNIT PROVIDED THEREWITH

PROBLEM TO BE SOLVED: To provide a small cooling device where an exothermic electronic component on a substrate can highly efficiently be cooled and the passage resistance of piping is small, and to provide an electronic unit provided with the cooling device. SOLUTION: In the cooling device, a liqui...

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Bibliographische Detailangaben
Hauptverfasser: KUSAKABE TAKESHI, AIZONO MASAMITSU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a small cooling device where an exothermic electronic component on a substrate can highly efficiently be cooled and the passage resistance of piping is small, and to provide an electronic unit provided with the cooling device. SOLUTION: In the cooling device, a liquid refrigerant is circulated, heat is taken from the exothermic electronic component mounted on the substrate by heat exchange with the liquid refrigerant, and taken heat is radiated by a radiator 3. The device is provided with a heat reception integrated pump 2 in which a heat reception part for thermally exchanging the exothermic electronic component and the liquid refrigerant flowing inside is arranged, and which sends the liquid refrigerant after thermal exchange to the radiator 3 by a liquid channel 5. The heat reception integrated pump 2 and the radiator 3 are oppositely arranged. A fan 4 which compulsorily cools the radiator 3 is arranged between them so that it faces them. COPYRIGHT: (C)2006,JPO&NCIPI