COOLING DEVICE AND ELECTRONIC UNIT PROVIDED THEREWITH
PROBLEM TO BE SOLVED: To provide a small cooling device where an exothermic electronic component on a substrate can highly efficiently be cooled and the passage resistance of piping is small, and to provide an electronic unit provided with the cooling device. SOLUTION: In the cooling device, a liqui...
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creator | KUSAKABE TAKESHI AIZONO MASAMITSU |
description | PROBLEM TO BE SOLVED: To provide a small cooling device where an exothermic electronic component on a substrate can highly efficiently be cooled and the passage resistance of piping is small, and to provide an electronic unit provided with the cooling device. SOLUTION: In the cooling device, a liquid refrigerant is circulated, heat is taken from the exothermic electronic component mounted on the substrate by heat exchange with the liquid refrigerant, and taken heat is radiated by a radiator 3. The device is provided with a heat reception integrated pump 2 in which a heat reception part for thermally exchanging the exothermic electronic component and the liquid refrigerant flowing inside is arranged, and which sends the liquid refrigerant after thermal exchange to the radiator 3 by a liquid channel 5. The heat reception integrated pump 2 and the radiator 3 are oppositely arranged. A fan 4 which compulsorily cools the radiator 3 is arranged between them so that it faces them. COPYRIGHT: (C)2006,JPO&NCIPI |
format | Patent |
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SOLUTION: In the cooling device, a liquid refrigerant is circulated, heat is taken from the exothermic electronic component mounted on the substrate by heat exchange with the liquid refrigerant, and taken heat is radiated by a radiator 3. The device is provided with a heat reception integrated pump 2 in which a heat reception part for thermally exchanging the exothermic electronic component and the liquid refrigerant flowing inside is arranged, and which sends the liquid refrigerant after thermal exchange to the radiator 3 by a liquid channel 5. The heat reception integrated pump 2 and the radiator 3 are oppositely arranged. A fan 4 which compulsorily cools the radiator 3 is arranged between them so that it faces them. 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SOLUTION: In the cooling device, a liquid refrigerant is circulated, heat is taken from the exothermic electronic component mounted on the substrate by heat exchange with the liquid refrigerant, and taken heat is radiated by a radiator 3. The device is provided with a heat reception integrated pump 2 in which a heat reception part for thermally exchanging the exothermic electronic component and the liquid refrigerant flowing inside is arranged, and which sends the liquid refrigerant after thermal exchange to the radiator 3 by a liquid channel 5. The heat reception integrated pump 2 and the radiator 3 are oppositely arranged. A fan 4 which compulsorily cools the radiator 3 is arranged between them so that it faces them. 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SOLUTION: In the cooling device, a liquid refrigerant is circulated, heat is taken from the exothermic electronic component mounted on the substrate by heat exchange with the liquid refrigerant, and taken heat is radiated by a radiator 3. The device is provided with a heat reception integrated pump 2 in which a heat reception part for thermally exchanging the exothermic electronic component and the liquid refrigerant flowing inside is arranged, and which sends the liquid refrigerant after thermal exchange to the radiator 3 by a liquid channel 5. The heat reception integrated pump 2 and the radiator 3 are oppositely arranged. A fan 4 which compulsorily cools the radiator 3 is arranged between them so that it faces them. COPYRIGHT: (C)2006,JPO&NCIPI</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
title | COOLING DEVICE AND ELECTRONIC UNIT PROVIDED THEREWITH |
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