ELECTRONIC COMPONENT COMPRESSION MOUNTER

PROBLEM TO BE SOLVED: To perform compression mounting operation quickly while suppressing impact load at the time of compression mounting an electronic component on a substrate. SOLUTION: Impact load can be controlled at the time of touching an electronic component to a substrate by driving a nozzle...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SAITO MASARU, HACHIMAN NAOYUKI, ANZAI HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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