ELECTRONIC COMPONENT COMPRESSION MOUNTER

PROBLEM TO BE SOLVED: To perform compression mounting operation quickly while suppressing impact load at the time of compression mounting an electronic component on a substrate. SOLUTION: Impact load can be controlled at the time of touching an electronic component to a substrate by driving a nozzle...

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Bibliographische Detailangaben
Hauptverfasser:	SAITO MASARU, HACHIMAN NAOYUKI, ANZAI HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To perform compression mounting operation quickly while suppressing impact load at the time of compression mounting an electronic component on a substrate. SOLUTION: Impact load can be controlled at the time of touching an electronic component to a substrate by driving a nozzle 19, an electronic component being sucked and compression mounted by the nozzle 19, and a load cell 26 upward to compensate for the total weight thereof by means of a VCM 14. After the electronic component is touched to the substrate, the driving force is directed downward and pressing force of the electronic component against the substrate is increased gradually up to a set level. COPYRIGHT: (C)2006,JPO&NCIPI