THERMOSETTING FLAME-RETARDANT RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a thermosetting flame-retardant resin composition containing no halogen and suitable for an electric insulating material which is used for an electronic circuit board and electronic parts corresponding to high frequency. SOLUTION: This thermosetting flame-retardant r...

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Hauptverfasser: UCHIYAMA RYOTA, NISHIGUCHI SHOJI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a thermosetting flame-retardant resin composition containing no halogen and suitable for an electric insulating material which is used for an electronic circuit board and electronic parts corresponding to high frequency. SOLUTION: This thermosetting flame-retardant resin composition is a composition comprising the phosphorus content of 0.5-5 wt% in the total composition and prepared by compounding a phosphoric ester compound represented by general formula (I) (wherein X is an aromatic group that may be different from each other and at least one of the X in a molecule is an aromatic group having an alkyl group at ortho site, Y represents a 1-20C arylene group or alkylene group, and n is an integer of 0-20), to a thermosetting resin mainly composed of a vinylbenzyl compound. COPYRIGHT: (C)2006,JPO&NCIPI