CURING AQUEOUS RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide an aqueous resin composition generating no formalin at the time of curing and from a cured matter obtained, and superior in thermal curing property. SOLUTION: The thermally curing aqueous resin composition comprises: an aqueous resin (A) obtained by polymerizing mono...

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Bibliographische Detailangaben
Hauptverfasser:	SHIRAGA JUN, NAKAMURA KATSUYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an aqueous resin composition generating no formalin at the time of curing and from a cured matter obtained, and superior in thermal curing property. SOLUTION: The thermally curing aqueous resin composition comprises: an aqueous resin (A) obtained by polymerizing monomer components containing no monomer component having a carboxyl group (a-1), but containing an ethylenically unsaturated monomer containing a tertiary amino group (a-2), and an ethylenically unsaturated monomer containing a hydroxy group (a-3), in the presence of a carboxyl group-containing polymer (A') formed by polymerizing the monomer components (a-1) having carboxyl groups as indispensable components; a compound (B) containing a silanol group and/or a hydrolytic silyl group; and a polyisocyanate resin and/or a block polyisocyanate resin (C). COPYRIGHT: (C)2006,JPO&NCIPI