MANUFACTURING METHOD OF WIRING BOARD FOR MOUNTING SEMICONDUCTOR, AND MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS

PROBLEM TO BE SOLVED: To provide manufacturing methods of a wiring board for mounting a semiconductor and of a semiconductor apparatus which are effective for the increase in terminals and the fine-pitch of terminal gaps due to high-integration, high-speed, and multi-functionalization of semiconductor devices, can mount semiconductor devices especially on both surfaces of a board in a high density and with a high precesion, and is further excellent in reliability. SOLUTION: The wiring board 5 comprises at least an insulation film 1, wiring 2 formed in the insulation film 1, and a plurality of electrode pads 4 which are made mutually conductive by the wiring 2 and vias 3. The electrode pads 4 are disposed on the front and back surfaces of the insulation film 1 with the surfaces of the pads exposed and at least a part of the sides of the electrode pads embedded in the insulation film 1. The insulation film 1 is formed by forming respective electrode pads 4 on two metal sheets, stacking insulation layers and wiring on the electrode pads 4 and the metal plates, laminating, and integrating the insulation layers, and then removing the metal sheets. COPYRIGHT: (C)2006,JPO&NCIPI