COATING FOR REINFORCING ADHESION OF MOLDING COMPOUND TO SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide coating for attaching primer to a whole lead frame in order to reinforce the connection of a plastic molding compound to a lead frame and an IC chip. SOLUTION: A semiconductor device is coated with a polymer primer before molding the semiconductor device so that the...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LI JIANXIONG, CHAW CHI CHUEN, TSUI NGAI KIN, KWAN YIU FAI, LIU DEMING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide coating for attaching primer to a whole lead frame in order to reinforce the connection of a plastic molding compound to a lead frame and an IC chip. SOLUTION: A semiconductor device is coated with a polymer primer before molding the semiconductor device so that the adhesion of the semiconductor device to a molding compound can be reinforced with a semiconductor chip mounted on a carrier such as a lead frame. The above mentioned coating of the semiconductor device may be executed by coating the semiconductor with polymer solution, or by attaching the polymer solution to the semiconductor device by dipping, dripping or spraying. COPYRIGHT: (C)2006,JPO&NCIPI