CIRCUIT WIRING COMPOSITE SUBSTRATE

PROBLEM TO BE SOLVED: To provide a circuit wiring composite substrate thinned by decreasing the total thickness of a composite structure of an RPC and an FPC. SOLUTION: The circuit wiring composite substrate comprises at least one of rigid circuit board 1a in which a circuit wiring layer is formed on a rigid insulating substrate 2a, and a first and a second flexible circuit boards 11a and 11b in which circuit wiring layers are formed on flexible insulating substrates 12a and 12b, respectively. The first and the second flexible circuit boards 11a and 11b, respectively, have overlapped part Xa1 and Xb1 which is overlapped and fixed on respective sides of the board surfaces of the rigid circuit board, and deformable parts Ya and Yb which are not overlapped with the board surfaces. In the position where the rigid circuit board is overlapped with the flexible circuit boards, at least one of interlayer conduction path for electrically connecting circuit wiring layers of these circuit boards is made to go through. COPYRIGHT: (C)2006,JPO&NCIPI