SEMICONDUCTOR LASER APPARATUS

PROBLEM TO BE SOLVED: To provide a semiconductor laser apparatus wherein a joining strength of solder is sufficient for preventing the separation of a semiconductor laser chip from a mounting substrate. SOLUTION: A semiconductor laser apparatus (10) is provided and comprises the mounting substrate (6); the semiconductor laser chip (1) joined to the mounting surface (6a) of the mounting substrate (6) with the solder (5); and emitters (3) and non-active mesa portions (4) formed on the joining surface (1a) of the semiconductor laser chip (1) to be joined to the mounting surface (6a) of the mounting substrate (6), and each of the emitters (3) and the non-active mesa portions (4) is separated from the other by component separating channels (2) formed on the joining surface (1a) of the mounting substrate. At least one mesa separating channel (7) for separating the non-active mesa portion (4) is formed in the non-active mesa portion (4) at the joining surface (1a) of the semiconductor laser chip (1). The solder between the joining surface of the semiconductor laser chip and the mounting surface of the mounting substrate includes fillets (9a, 9b) disposed in the inner walls of the component separating channel and the mesa separating channel. The fill factor is preferably 50% or more. COPYRIGHT: (C)2006,JPO&NCIPI